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Features - Enterprise Data Insights:NEC DEVELOPS HIGH-CAPACITY 512 Kb MRAMNEC Corporation (NEC) announced recently at the 2003 International Solid-State Circuits Conference (ISSCC) the successful development of 512-kilobit (Kb) cross-point (CP) magnetoresistive random-access memory (MRAM) comprising a simple CP-type cell structure that enables high-density data storage. MRAM is expected to be used extensively as next-generation memory in mobile telephones, laptop computers and other computers because of its speed, nonvolatility, low power and high density. NEC's CP-type MRAM was fabricated using the company's 0.25um CMOS and 0.6um MRAM processes. Its simple CP cell structure, which consists of a word line (WL), a bit line (BL) and a magnetic tunnel junction (MTJ), is capable of very high-capacity processing and is expected to be used widely as MRAM for high-speed file applications. In a conventional CP structure, the cells in the memory array are not isolated, and the output signal during read operation tends to become overwhelmed by parasitic noise, making a selected CP cell's data difficult to read. To resolve this problem, NEC developed a new cell selection method and current sense amplifier that effectively improved the signal-to-noise (S/N) ratio during read operation and, at the same time, reduced the chip size by 20 percent over previous methods. Major features of the new NEC CP-type MRAM:
MRAM is nonvolatile memory that uses magnetic elements rather than electric ones to store information. Because of its low-power and high-performance characteristics, MRAM is expected to replace the DRAM and flash memory that presently dominate the memory market. MRAM technology is particularly seen as an ideal next-generation memory for products with embedded logic. MRAM technology has a very low operating voltage (approximately one-tenth that of flash memory), and can be endlessly rewritten with no data loss (whereas existing flash memory is limited to about one million times). MRAM also can be easily incorporated into CMOS devices, because the MTJ device can be integrated into a device after the CMOS manufacturing process is complete. Additionally, MRAM memory capacity can be increased significantly by layering the simple cell structure. NEC will now aim to advance this achievement in collaboration with Toshiba Corporation. In September 2002, the two companies combined their respective technological capabilities and formed an MRAM development team aimed at accelerating the research and development of MRAM technology and bringing it to the product development level. Results of the research were presented at ISSCC 2003 in San Francisco, February 9-13. NEC CorporationNEC Corporation is one of the world's leading providers of broadband and mobile Internet solutions dedicated to meeting the specialized needs of its diverse and global base of customers. Ranked as a Global Fortune 500 company and one of the world's top patent-producing companies, the NEC group delivers tailored solutions in the core technologies and services required in a networked world, ranging from advanced semiconductor solutions, to high-speed, large-capacity mission critical systems, system integration, and broadband and mobile technologies. The NEC group employs more than 140,000 people worldwide and had net sales of approximately $39 billion in the fiscal year ended March 2002. For additional information, please visit the NEC home page at www.nec.com/. Contact: Kazuko Andersen of NEC USA, 212-326-2502, or kazuko.andersen@necusa.com. |
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