Features - Storage Innovations:

ISSI ANNOUNCES FIRST 8MBIT HIGH-SPEED ASYNCHRONOUS SRAM

Integrated Silicon Solution Inc, a leader in advanced memory solutions, has announced the industry's first 8Mbit high-speed asynchronous monolithic backward compatible SRAM. ISSI offers this device in several packages including a TSOP package that is compatible with the industry standard 4Mbit SRAM with the exception of the extra address line. These high-speed, low power devices operate in the 3.3V range. They are fabricated using high-performance 0.15micron CMOS technology. This highly reliable process coupled with innovative circuit design techniques yields high-performance and low power consumption devices.

ISSI's 8Mbit high-speed asynchronous SRAM is available in both x16 and x8 configurations. The x16 (IS61LV51216) and x8 (IS61LV10248) feature the following: high-performance with high-speed access times of 8ns, low power consumption with typical operating current of 90mA, and typical standby current less than 5mA.

These devices are targeted for applications in networking/broadband, digital consumer, mobile communications, and automotive markets. They include, but are not limited to, VOIP, WLAN, telecom applications, POS terminals and other handheld applications.

"All four of ISSI's focus markets benefit from the 8Mbit high-speed asynchronous device, providing a greater selection for customer satisfaction," said Sanjiv Asthana, ISSI's vice president of marketing. "Our ability to meet customer demands for high-speed and low-power devices is made possible by our access to leading-edge technology."

Price, Packaging, and Availability

For quantities of 10,000, the 8Mbit SRAM is priced at $11.95. The x16 (IS61LV51216) is available in 48-ball mBGA, and 44-pin TSOPII JEDEC standard packages. The x8 (IS61LV10248) is available in 48-ball and 36-ball mBGA, and 44-pin TSOPII JEDEC standard packages. Samples are available now, with volume production shipments beginning in Q2 2003.

About ISSI

ISSI is a technology leader in high performance memory semiconductors. The company designs, develops and markets memory products used in networking, Internet infrastructure, telecommunications, wireless products, handheld devices, computer peripherals, and automotive electronics. ISSI's products incorporate state-of-the-art circuit design and advanced process technology. The company's high speed and low power SRAM, low to medium density DRAM, MCP (combining Flash and SRAM/PSRAM), Parallel Search Processors (CAM), a family of EEPROMs, and Bluetooth(TM) wireless chipsets (in development), enable designers to meet the demanding connectivity, portability, and bandwidth requirements of today's high tech products. ISSI is headquartered in Silicon Valley with worldwide offices in China, Europe, Hong Kong, Taiwan and Korea. Visit our Web site at www.issi.com.

Contact: Ron Kalakuntla of Integrated Silicon Solution Inc, 408-969-4675, or ron_kalakuntla@issi.com.